Microe CE300 ChipEncoder Manual do Utilizador descarregar pdf (Página 7)

Miscellaneous Application Notes

The printed circuit board (PCB) land pattern and assembly processes necessary to successfully integrate the CE300’s Ball Grid Array (BGA) package are

detailed as follows:

• IPC-SM-782 (land pattern standard) should be used as a guide for proper land pattern design for the solder pads on the printed

circuit board.

• Due to the tight spacing between solder pads, it is recommended that there be solder mask between the solder pads to prevent

solder bridging and shorting to adjacent pads.

• A stainless steel stencil, 0.003 inch [0.08 mm] thick is recommended for solder paste application to the printed

circuit board lands.

• Machine placement and reflow soldering of the CE300 is preferred. If hand soldering is necessary, soldering to the castellations

should be done noting precautions in the preceding section of this manual.

• Acetone is the recommended cleaner for the CE300.

Output Signal Descriptions

PCB Requirements

The CE300 electrical interface, land pattern, schematic of additional required passive components and mechanical dimensions are found in the CE300’s interface

drawings. See page 5 for instructions on downloading interface drawings.

Bottom view of ChipEncoder

Page 7

Pad Function Pad Function

1 Index Window+ 13 AN

2 GND 14 Sin+

3 RESERVED 15 RESERVED

4 RESERVED 16 RESERVED

5 CP+ 17 RESERVED

6 +5VA 18 GND

7 RESERVED 19 +5VD

8 GND 20 B+

9 DC2 21 B-

10 RESERVED 22 A+

11 DC1 23 A-

12 RESERVED 24 Index Window+

PAD 1

PAD 20

PAD 8

PAD 13

1 2 3 4 5 6 7 8 9 10

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Microe CE300 ChipEncoder Manual do Utilizador Página 7

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